Model No. | JJBP-0141-0001 |
---|---|
Material | AlN |
Specification | Max. up to 140mm× 190mm |
Forming Method | |
Color Available | Grey |
Incoterm | CFR, CIF, CIP, CPT, DAP, DAT, DDP, EXW, FAS, FCA, FOB |
Terms of Payment | LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, RMB |
HS Code | 8547100000 |
Aluminum nitride (AlN) is a ceramic material commonly used in bare ceramic substrates. It has two very important characteristics: high thermal conductivity, and the expansion coefficient (CTE) matching Si.
1. Aluminum nitride is currently the best thermally conductive material and is used in a variety of applications where heat needs to be transferred away from the component.
2. The low coefficient of thermal expansion makes AlN an ideal material for packages and submounts for power components such as power LEDs, high-power ICs, and high-voltage inductors.
Al2O3 | Properties VS | AlN |
white dense | Appearance | gray dense |
0.15-0.3 | Surface Roughness (Ra, μm) | 0.2-0.7 |
>24 | Thermal Conductivity (20ºC, W/m·K) | ≥170 |
7.8 | CTE (1×10-6/ºC) | 4-6 |
9.5 | Dielectric constant (E) | 9 |
≥17 | Dielectric Strength (KV/mm) | ≥15 |
1. We can produce ceramic substrates in various standard shapes, and can also provide customized shapes through secondary processing such as laser scribing, laser cutting, and precision machining.
2. Standard thicknesses include 0.1-0.2mm, 0.2mm, 0.38mm, 0.50mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm. Other thicknesses can also be customized if required.
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